用户名: 密码:
主页 设为首页 加入收藏
      产品中心       技术中心       下载中心        社区新闻        诚聘英才       大学计划        关于我们       技术论坛
  您的当前位置:ADSP开源社区 >> 社区新闻 今天是:
视频培训
产品导航
ADI DSP仿真器
SigmaDSP开发板
ADI A2B总线开发板
SHARC DSP开发板
销售网络
社区新闻  
ADI公司推出最新的BF70X处理器,OpenADSP开源社区仿真器全面支持
[ 作者:OP ] [ 来源: ] [ 发布时间:2014-6-18 ]

ADI公司正式推出BF70X处理器。

This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.

The processor offers performance up to 200 MHz, as well as lowest power consumption at <53mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.

By integrating a rich set of industry-leading system peripherals , large on-chip memory & a high speed external memory interface, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.

特点和优势

  • Blackfin+ core with up to 200 MHz performance
    - Dual 16-bit or single 32-bit MAC support per cycle
    - 16-bit complex MAC and many other instruction set enhancements
    - Instruction set compatible with previous Blackfin product
  • On-Chip Memory
    - 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
    - 128KByte on-chip L2 SRAM with ECC protection
    - 512KByte On-chip L2 ROM
  • L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)
  • Key Peripherals include
    - USB2.0 HS OTG
    - 2x CAN2.0B
    - ePPI Video I/O
    - 2x SPORTs (w/I2S)
    - 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
    - I2C
    - 2xUART
    - SD/SDIO/MMC (8-bit)
    - 4-ch 12-bit 1MSPS ADC
  • Security and one-time-programmable memory
    - Crypto hardware accelerators for fast secure boot/IP protection
    memDMA encryption/decryption for fast run-time security
  • Low-cost packaging
    - 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant
  • Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

OpenADSP开源社区的仿真器能够完全支持BF70x,

AD-HP530ICE: http://item.taobao.com/item.htm?spm=a1z10.5.w4002-2134335524.11.aVQ84P&id=14016424869

如有需要,可联系sale@openadsp.com;手机:18611096839;QQ:5516164

BF70X开发板正在研发中,敬请期待!

 

联系我们 | 关于我们 | 免责声明 | 诚征英才 | 友情链接
Copyright 2019 All rights reserved  本网页版权属Open ADSP所有
北京海淀区中关村大街32号新中发市场3659 邮编100100
电话 18611096839 
粤ICP备14035876号-1